Abstract: A solder mask technology by laser marking is proposed to solve the uncontrollable phenomenon of solder spreading on the surface of the gold-plated shell of transmitter and receiver (T/R) modules during the soldering process. This technology uses laser to cut a narrow mark at a specific position on the surface of the product shell, destroying the gold plating and thus achieving the effect of blocking the overflow of solder. Furthermore, it utilizes the characteristic of the product material that is not easily wetted by solder to improve the solder mask effect. Firstly, the optimal parameters for laser marking of T/R modules is obtained through multiple laser marking experiments in this paper; Secondly, through high temperature and oxidation experiments, it is proved that the laser marking technology will not cause additional damage to the edge of the marking line; Then, through solder mask experiments, it is proved that the laser marking solder mask technology can effectively prevent the overflow of solder and will not have any other effects on the weldability of the shell; Finally, through the actual production verification, it is proved that the laser solder mask marking technology can meet the actual production of solder mask requirements by using special positioning fixtures.