Ku波段高功率堆叠式T/R组件设计

    Design of a Ku-band High-power Stacked T/R Module

    • 摘要: 基于Ku波段低剖面大功率多功能有源相控阵雷达系统收发(T/R)组件工程化应用需求,传统砖块式T/R组件结构尺寸大,集成度不高,难以满足雷达平台向更低剖面、小型化与共形化升级的设计要求。为此,文中研制了一款Ku波段高集成度、高功率密度的堆叠式T/R组件。该组件攻克了一体化混合高密度集成、高精度三维堆叠垂直互联、高热流密度高效散热、狭小空间复杂电磁兼容、梯度铝硅一体化封装等多项关键技术,可为T/R组件实现高密度集成、小型化与轻量化设计提供切实可行的技术方案。文中详细阐述了该T/R组件的原理设计、电路设计及高精度垂直互联设计方法;同时引入传递函数思想,构建了高密度集成多场耦合稳健优化设计模型,有效解决了狭小空间内T/R组件的稳定性难题,大幅提高了组件的设计效率。基于上述设计开展组件实物加工与测试验证,结果表明,该组件幅相等指标一致性好,具备良好的可制造性,可满足工程化、批量化生产要求,目前已成功应用于新型片式架构多功能雷达等装备平台。

       

      Abstract: While considering the engineering application requirements of the transmitter and receiver (T/R) modules of low-profile, high-power, multi-functional active phased radar systems within the Ku-band, the traditional brick-type T/R modules suffer from large structural dimensions and low-level integration, making it difficult to meet the design requirements of radar platforms while upgrading to lower profile, miniaturization, and conformal design. Therefore, a high-integration, high-power stacked T/R module within the Ku-band is developed in the paper. The design of the module overcomes multiple key technical challenges, including integrated hybrid high-density integration, high-precision three-dimensional stacked vertical interconnection, high-efficiency dissipation of heat with high heat flux density, complex electromagnetic compatibility in confined space, and gradient aluminum-silicon integrated packaging, and provides a feasible technical solution for achieving high-density integration, miniaturization, and lightweight design of T/R modules. In this paper, the methods of principle design, circuit design and high-precision vertical interconnection design of the T/R module are comprehensively elaborated; meanwhile, a robust optimization model for high-density integration and multi-field coupling design is proposed by introducing the idea of transfer function, effectively solving the stability issue of the T/R module in confined space and significantly improving the module′s design efficiency. Physical fabrication and testing of the module, based on the above design, are carried out. The results show that the module exhibits superior consistency in amplitude and phase performance, excellent manufacturability, and ease of engineering and mass production, and it has been successfully applied to equipment platforms such as novel chip-based multi-functional radar system.

       

    /

    返回文章
    返回