Abstract: With the rapid advancement of satellite technology, miniaturization and lightweight design have become crucial trends in satellite development. To meet the demands of satellite miniaturization, there is an urgent need for secondary power supplies that are highly integrated, efficient, and lightweight. This paper focuses on the key microassembly technologies for satellite secondary power supplies, detailing the research on bonding of high thermal conductivity materials for magnetic components, aluminum wire bonding for power chips, and hermetic packaging technology for secondary power supplies. These technologies address the challenges in miniaturizing and integrating satellite secondary power supplies. Based on these technologies, a certain type of satellite secondary power supply has been developed and meets the required specifications. The research findings provide a strong foundation for the further development of satellite secondary power supplies.