Abstract: With the improved requirements of high concentration for power devices, the research of high-efficiency cooling technology and microsystem cooling is advancing. The current microsystem cooling has problems of poor tolerance impurity ability in microflow channel, a large volume in final-stage heat exchanger, and low heat dissipation efficiency in system. A self-circulating cooling structure is designed and established. A prototype of the self-circulating micro-cooling system of integrated heat sink, micropump, and microheat exchanger is developed. The test results show that the chip cooling of 500 W/ cm2 can be achieved.