A Study on Induction Soldering Process of a Bus Bar Assembly

The rapid local advantage of induction heating is used, the soldering of the socket and the four-layer confluence of copper plate are realized by induction soldering technology. Through the design of the soldering head and the simulation of the induction heating process, the design of the sensor is optimized, the uniform temperature field is obtained, the local quick soldering of the soldering head is realized. The appropriate solder shape and the preset method of the solder are selected according to the tube foot size and weld depth of the socket, ensuring the forming quality and consistency of the soldering seam. Through the research of induction soldering process, the curing process parameters and procedures are obtained, the reliable connection between the copperplate and the socket pipe is realized. The soldering seam is detected by macroscopic metallography and microcosmic metallography, the soldering head forms a continuous soldering round angle and a uniform soldering seam.