A Review of Antenna-in-package Technology for Millimeter-wave Phased Array Antennas

With the use of micro-electronic technology and three-dimensional integration processing, Antenna-in-package (AiP) technology can embed antennas and circuits into an extremely confined package. The adoption of AiP technology within phased array antenna applications will surely accelerate its development and achieve systems with high frequency, small form factor and low cost. Prospective application scenarios are presented, as well as the concept and prerequisites of AiP technology. In this paper, technical routes are classified into ceramic, silicon, organic, and mixed types by the material used. Key techniques are stated and summarized, with respect to architecture, process, thermal management, simulation, and test. As a whole, this paper aims to provide valuable reference and promote the research and development of AiP technology for millimeter-wave phased array antenna applications.