Testing Technology for Wafer Level Heterogeneous Integration Millimeter-wave Transceiver Module

Wafer level packaging (WLP) technology can significantly compress the volume and weight of the front-end transceiver module, realizing the miniaturization of active phased array radar. However, it also brings great challenges, such as heat management, channel isolation, signal cross-talk and adaptability of repairing and testing. Due to the introduction of more process steps and complex package architecture, how to test wafer level packaging modules to ensure yield and reduce testing costs has become an important technical issue. In this paper, the wafer level heterogeneous integration technology in millimeter-wave is summarized. Besides, the testing requirements and technical challenges, along with some integration solutions and testing process of typical products are deeply discussed. The existing key technologies are sorted out from three aspects: wafer level testing with probe station, socket testing and over the air (OTA) testing. It can provide some valuable references for the construction of radio frequency wafer level 3D packaging modules.